US Patent Issued to SCHOTT on June 16 for "Hermetically sealed glass package including a heat-dissipating base substrate, a cap, and a laser bonding line" (German, Japanese, Finnish Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,674, issued on June 16, was assigned to SCHOTT AG (Mainz, Germany).

"Hermetically sealed glass package including a heat-dissipating base substrate, a cap, and a laser bonding line" was invented by Thomas Zetterer (Landshut, Germany), Robert Hettler (Kumhausen, Germany), Antti Maattanen (Tampere, Finland), Jens Ulrich Thomas (Mainz, Germany), Yutaka Onezawa (Otsu, Japan) and Frank Gindele (Schweitenkirchen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A hermetically sealed package includes: a heat-dissipating base substrate configured for dissipating heat from the hermetically sealed package; a cap arranged on the heat-dissipating base subs...