US Patent Issued to Schott on April 7 for "Hermetically sealed glass package" (German, Swedish, Austrian, Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,169, issued on April 7, was assigned to Schott AG (Mainz, Germany).

"Hermetically sealed glass package" was invented by Robert Hettler (Kumhausen, Germany), Jens Ulrich Thomas (Mainz, Germany), Antti Maattanen (Tampere, Sweden), Jochen Herzberg (Allhaming, Austria), Yutaka Onezawa (Otsu, Japan) and Thomas Zetterer (Landshut, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A hermetically sealed package for thermal encapsulation of a functional area includes: a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or...