ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,201, issued on July 14, was assigned to SAULTECH TECHNOLOGY Co. LTD. (Hsinchu County, Taiwan).
"Die-bonding method for preventing die from bending" was invented by Yen Hao Lu (Zhubei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for preventing die from bending is provided, including: disposing a plurality of solder balls between a circuit layer and a substrate; preheating the substrate and the glass carrier respectively with a temperature lower than the melting point of the solder balls; one of the substrate and the glass carrier being made of a first material, and the other made of a second material; the first material having...