US Patent Issued to Sandisk Technologies on Oct. 20 for "Packaged memory device with overhang support structure" (Chinese, Malaysian Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,464, issued on Oct. 20, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Packaged memory device with overhang support structure" was invented by Shujun Zheng (Shanghai), Jason Xiao (Shanghai), Youhua Xu (Shanghai), Yvonne Ming (Shanghai), Jiun Dong Loeh (Penang, Malaysia), Shino Jian (Shanghai) and Fen Yu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device includes a substrate, a controller die attached to the substrate, and a memory die stack. The memory die stack includes a first silicon die having a first contact pad surface and a bottom surface attached to the substrate. The memory die stack includes a second s...