US Patent Issued to Sandisk Technologies on May 19 for "Wire bonding machine having a rotatable capillary to secure a bond wire to a connection point" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,080, issued on May 19, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Wire bonding machine having a rotatable capillary to secure a bond wire to a connection point" was invented by Jingyun Chen (Shanghai), Fen Yu (Shanghai), Guangqiang Li (Shanghai), Pengchen Ai (Shanghai), Fuqiang Xiao (Shanghai), Shujun Zheng (Shanghai), Yuan Ming (Shanghai), Sizhe Yue (Shanghai) and Lian Chen (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wire bonder has a rotatable capillary for forming a stitch bond on a bonding surface of a connection point. When the stitch bond is formed, a bond head of the wire bonder causes the capillary to rotate...