US Patent Issued to Sandisk Technologies on March 31 for "Printed circuit board having lead pads that accommodate offset electronic component leads" (Malaysian Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,406, issued on March 31, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Printed circuit board having lead pads that accommodate offset electronic component leads" was invented by Choong Keat Loh (Georgetown, Malaysia), Chii Jian Saw (Bayan Lepas, Malaysia), Chun Yan Koay (Seberang Perai, Malaysia) and Soon Chai Tee (Bayan Lepas, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board (PCB) includes lead pads that are shaped and sized to account for offset leads of an electronic component, such as a capacitor. A proximal end of the lead pad has a first dimension and a distal end of the lead pad has a second di...