US Patent Issued to Sandisk Technologies on March 17 for "Apparatus and methods for bonding pad redistribution layers in integrated circuits" (California Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,984, issued on March 17, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Apparatus and methods for bonding pad redistribution layers in integrated circuits" was invented by Guangyuan Li (Santa Clara, Calif.), Yuji Totoki (Milpitas, Calif.) and Fumiaki Toyama (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is provided that includes an integrated circuit die that includes an uppermost metal layer of an integrated circuit fabrication process, a plurality of first bonding pads disposed on the uppermost metal layer at a first bonding pad pitch, a first additional metal layer disposed above the uppermost meta...