US Patent Issued to SANDISK TECHNOLOGIES on June 9 for "Semiconductor device package with die stackup and interposer" (California, Washington Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,046, issued on June 9, was assigned to SANDISK TECHNOLOGIES INC. (Milipitas, Canada).

"Semiconductor device package with die stackup and interposer" was invented by Nagesh Vodrahalli (Los Altos, Calif.), Chih-Yang Li (Menlo Park, Calif.), Shrikar Bhagath (San Jose, Calif.) and Narayanan Terizhandur V (Bothell, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a substrate, a stack of memory dies positioned on the substrate, and an interposer spaced from the stack of memory dies and also positioned on the substrate. First and second sets of bond pads are electrically connected to the substrate, where the secon...