US Patent Issued to Sandisk Technologies on June 30 for "Substrate having an increased metal trace thickness" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,568, issued on June 30, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Substrate having an increased metal trace thickness" was invented by Rui Yuan (Shanghai), Zengyu Zhou (Shanghai), Yihao Chen (Shanghai), Fen Yu (Shanghai) and Wenbin Qu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thickness of a signal trace on a printed circuit board (PCB) or a substrate is increased by intentionally forming a solder bridge on a surface of the signal trace during a reflow process in which a flip chip die or other computing component is mounted to the PCB or the substrate. Specifically, adjacent interconnects of the flip chip die are...