US Patent Issued to Sandisk Technologies on June 16 for "High density semiconductor device including integrated controller, logic circuit and memory dies" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,691, issued on June 16, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"High density semiconductor device including integrated controller, logic circuit and memory dies" was invented by Jayavel Pachamuthu (San Jose, Calif.), Srinivasan Sivaram (Los Gatos, Calif.) and Masaaki Higashitani (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated controller, logic circuit and memory array ("CLM") semiconductor device includes stacked controller, memory array logic circuit and memory array wafers, or individual dies diced therefrom, which together operate as a single, integrated semiconductor flash memory device. The...