US Patent Issued to Sandisk Technologies on July 14 for "Integrated die ejector for die attach ejector devices" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,070, issued on July 14, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Integrated die ejector for die attach ejector devices" was invented by Simon Yan (Shanghai), JianHua Wang (Shanghai), Kaijian Shi (Shanghai), Bin Liu (Shanghai), Zhonghua Qian (Shanghai), Jim Zhang (Shanghai), Joyce Chen (Taichung, China) and Juan Zhou (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated die ejector for separating a die from a wafer, the die ejector includes an ejector mechanism that includes an ejector pin. There is an ejector base coupled to the ejector pin and configured to couple the integrated die ejector to a die attach eje...