US Patent Issued to Sandisk Technologies on Aug. 11 for "Three-dimensional memory device containing dummy via cavities and method for making same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,959, issued on Aug. 11, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Three-dimensional memory device containing dummy via cavities and method for making same" was invented by Daichi Saito (Yokkaichi, Japan), Masaaki Shinohara (Yokkaichi, Japan), Ryo Yoshimoto (Yokkaichi, Japan) and Koichi Ito (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first-tier alternating stack of first-tier insulating layers and first-tier electrically conductive layers, a second-tier alternating stack of second-tier insulating layers and second-tier electrically conductive layers that overlies the first...