US Patent Issued to Sandisk Technologies on April 14 for "Trench patterning process using microcracking" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,474, issued on April 14, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Trench patterning process using microcracking" was invented by Motoki Kawasaki (Yokkaichi, Japan), Shunsuke Takuma (Yokkaichi, Japan) and Seiji Shimabukuro (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a first-tier structure over a substrate, forming first-tier trenches laterally extending along a first horizontal direction and laterally spaced apart from each other along a second horizontal direction through the first-tier structure, non-conformally depositing a plurality of material layers over the first-tier struct...