US Patent Issued to SAMSUNG SDI on March 17 for "Curable resin composition, cured film formed therefrom, and electronic device having cured film" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,401, issued on March 17, was assigned to SAMSUNG SDI Co. LTD. (Yongin-si, South Korea).

"Curable resin composition, cured film formed therefrom, and electronic device having cured film" was invented by Dongju Shin (Suwon-si, South Korea), Ji Yoon Kim (Suwon-si, South Korea), Minji So (Suwon-si, South Korea), Seungeun Lee (Suwon-si, South Korea) and Jeehyun Ryu (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a curable resin composition including (A) a silicone-based polymer, (B) hollow particles including a silane group-containing cyclodextrin-based compound including an unsaturated bond on the su...