US Patent Issued to SAMSUNG SDI on June 30 for "Multi-slot die, coating method using the same, slurry supply system, and slurry supply method using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,667,863, issued on June 30, was assigned to SAMSUNG SDI Co. LTD. (Yongin-si, South Korea).

"Multi-slot die, coating method using the same, slurry supply system, and slurry supply method using the same" was invented by Kyungtaek Choi (Yongin-si, South Korea), Young-Hak Pyo (Yongin-si, South Korea), Jin Seo Park (Yongin-si, South Korea), Wonsub Seo (Yongin-si, South Korea), Gisung Kim (Yongin-si, South Korea), Byoungkuk Kim (Yongin-si, South Korea) and Sohun Kim (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-slot die includes a plurality of dies that form a continuous coating portion along a length direction on one electrod...