ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,907, issued on June 2, was assigned to SAMSUNG SDI Co. LTD. (Yongin-si, South Korea).
"Automatic wire connection apparatus for circuit board testing" was invented by Imsu Choi (Yongin-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an apparatus for connecting a wire for circuit board testing to a circuit board and a circuit board verification apparatus, the apparatus including a probe configured to electrically connect a test point included in the circuit board to a wire for circuit board testing by soldering the wire to the test point, and a robot arm configured to place the probe at a preset position on the circuit board....