US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Wafer temperature sensor including optical fiber, wafer temperature sensor system, and method of manufacturing wafer temperature sensor" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,014, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Wafer temperature sensor including optical fiber, wafer temperature sensor system, and method of manufacturing wafer temperature sensor" was invented by Yoshiaki Moriya (Yokohama, Japan) and Noriaki Imai (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer temperature sensor includes a first wafer, a second wafer, and a fiber bragg gratings (FBG)-type optical fiber, wherein the first wafer and the second wafer are bonded to each other, wherein at least one of a bonding surface of the first wafer and a bonding surface of the second wafer ...