US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Systems, methods, and apparatus for accessing memory with die-to-die interfaces" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,560, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea).

"Systems, methods, and apparatus for accessing memory with die-to-die interfaces" was invented by Soon Ju Kim (San Jose, Calif.), Hyoun Kwon Jeong (Pleasanton, Calif.) and Soogil Jeong (Pleasanton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus may include a die including a memory interface, a die-to-die (D2D) circuit comprising a D2D interface, and an intermediate section connected between the memory interface and the D2D interface, wherein the intermediate section comprises a transaction converter. The intermediate section may be configured to t...