US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Substrate including test circuit and substrate test apparatus including the substrate" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,460, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Substrate including test circuit and substrate test apparatus including the substrate" was invented by Junghyun Park (Suwon-si, South Korea), Yongil Kwak (Suwon-si, South Korea), Jekook Lyu (Suwon-si, South Korea) and Heeju Seo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a substrate including a test circuit capable of testing a damaged state thereof. The substrate includes a substrate body, and a test circuit arranged on at least one of an upper surface and a lower surface of the substrate body, wherein the test ci...