US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package including package cap" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,488, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including package cap" was invented by Joungphil Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor package comprising a package substrate having a mount region and a peripheral region that surrounds the mount region, a semiconductor device on the mount region of the package substrate, a package cap on the peripheral region of the package substrate and including a partition portion that surrounds the semiconductor device and an extension portion that covers the semiconductor device, and...