US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,487, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Youngdeuk Kim (Suwon-si, South Korea) and Mina Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a first substrate, a first chip structure on the first substrate, the first chip structure including at least one chip, a heat dissipation member on the first chip structure, the heat dissipation member including a heat dissipation plate including a first surface facing the first chip structure and a second surface opposite to the first surface and a se...