US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor device including lower semiconductor package having heat sink pattern" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,491, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device including lower semiconductor package having heat sink pattern" was invented by Ji Hwang Kim (Cheonan-si, South Korea), Jong Bo Shim (Anyang-si, South Korea), Jang Woo Lee (Seoul, South Korea), Yung Cheol Kong (Cheonan-si, South Korea) and Young Hoon Hyun (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically ...