US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Micro semiconductor chip transfer method and micro semiconductor chip transfer device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,294, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Micro semiconductor chip transfer method and micro semiconductor chip transfer device" was invented by Youngtek Oh (Suwon-si, South Korea), Dongho Kim (Suwon-si, South Korea), Joonyong Park (Suwon-si, South Korea), Junsik Hwang (Suwon-si, South Korea), Dongkyun Kim (Suwon-si, South Korea), Sanghoon Song (Suwon-si, South Korea), Minchul Yu (Suwon-si, South Korea) and Kyungwook Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micro semiconductor chip transfer method is provided and includes: preparing a transfer substrate includi...