US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Memory controller communicating with vertically stacked dies and semiconductor device including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,622, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Memory controller communicating with vertically stacked dies and semiconductor device including the same" was invented by Geonho Kim (Suwon-si, South Korea), Kyeongkeun Kang (Suwon-si, South Korea), Shinyoung Yi (Suwon-si, South Korea) and Kwanyeob Chae (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes at least one core die including a memory cell array, and a logic die configured to communicate with the at least one core die, the logic die includes first through fourth TSV circuit blocks including circui...