US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Light emitting diode module and method for manufacturing light emitting diode module" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,318, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Light emitting diode module and method for manufacturing light emitting diode module" was invented by Changjoon Lee (Suwon-si, South Korea), Seongho Son (Suwon-si, South Korea), Jongsung Lee (Suwon-si, South Korea), Wonsoon Park (Suwon-si, South Korea) and Donghun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting diode (LED) module includes: a substrate; a plurality of first electrodes arranged on a top surface of the substrate; a second electrode provided on the top surface of the substrate among the plurality of f...