ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,890, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Heat pump system" was invented by Soonjae Pyo (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump system in which a heat source is air, and may include: a compressor configured to compress a refrigerant, a first heat exchanger configured to exchange heat between the refrigerant and air, a second heat exchanger configured to exchange heat between the refrigerant and water, a first refrigerant pipe configured to discharge the refrigerant heat exchanged in the first heat exchanger during a defrosting operation for the first heat ...