US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,300, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Minjin Kim (Suwon-si, South Korea) and Seongho Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to semiconductor packages. An example semiconductor package comprises a package substrate that includes a signal pad and a ground pad, an interposer substrate on the package substrate, a semiconductor chip on the interposer substrate, a plurality of signal lines on a top surface of the package substrate, and a first connection terminal between the package substrate ...