US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor device and semiconductor package including the same" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,299, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor device and semiconductor package including the same" was invented by Kiwon Baek (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and semiconductor package, the device including a lower semiconductor chip including a lower through-electrode; an interposer mounted on the lower semiconductor chip, the interposer including an interposer substrate; a plurality of interposer through-electrodes penetrating through at least a portion of the interposer substrate in a vertical direction and electrically con...