US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor chip, semiconductor device, and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,331, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor chip, semiconductor device, and semiconductor package including the same" was invented by Eunsu Lee (Suwon-si, South Korea), Jongbo Shim (Suwon-si, South Korea) and Sungeun Pyo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first semiconductor chip. The first semiconductor chip includes a first semiconductor substrate having a first surface and a second surface opposite to the first surface, and having a first active layer adjacent to the first surface, the first semiconductor substra...