US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Packaged integrated circuit devices with enhanced dam structures that provide increased yield and reliability" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,338, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Packaged integrated circuit devices with enhanced dam structures that provide increased yield and reliability" was invented by Seunghyun Baik (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate, a first semiconductor chip on an upper surface of the substrate, and electrically conductive bumps extending between and electrically connected to the substrate and the first semiconductor chip. A non-conductive film layer is provided, which has at least a portion extending between the electrically co...