US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package including support member" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,643, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including support member" was invented by Bong Ken Yu (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor package in which warpage of an interposer is prevented to improve product reliability. The semiconductor package includes a first substrate including a first insulating layer, and a first conductive pattern disposed in the first insulating layer, a semiconductor chip disposed on the first substrate, an interposer disposed on the semiconductor chip, wherein the interposer includ...