US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package including semiconductor chip having through-electrode" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,659, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including semiconductor chip having through-electrode" was invented by Seungryong Oh (Suwon-si, South Korea) and Chajea Jo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first bonding layer, the first bonding layer including a first chip pad and a first insulating layer covering a side surface of the first chip pad, a second semiconductor chip disposed below the first semiconductor chip and including a substrate having front and rear surfa...