US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package having a plurality of semiconductor chips stacked on a semiconductor substrate" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,674, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package having a plurality of semiconductor chips stacked on a semiconductor substrate" was invented by Younglyong Kim (Anyang-si, South Korea), Hyunsoo Chung (Hwaseong-si, South Korea) and Inhyo Hwang (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The semiconductor package, includes: a package substrate; a substrate adhesive member on the package substrate; a plurality of semiconductor chips stacked on the substrate adhesive member and including first and second semiconductor chips; and a conductive connection member ...