US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,684, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Choongbin Yim (Suwon-si, South Korea), Ji-Yong Park (Suwon-si, South Korea) and Jin-Woo Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, substrate pads provided on a top surface of the package substrate, at least one core ball on at least one of the substrate pads, a redistribution substrate provided on the top surface of the package substrate, and a semiconductor chip mounted on the redistribution su...