ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,652, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package and method of manufacturing" was invented by Jaewon Choi (Suwon-si, South Korea) and Jongbo Shim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor package includes; positioning a passive element on an upper insulating layer of a package substrate, wherein the upper insulating layer of the package substrate exposes upper surfaces of first substrate pads and second substrate pads, the passive element includes; electrodes on respective corners of a lower surface of the passi...