ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,678, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Minseung Ji (Suwon-si, South Korea), Seungduk Baek (Suwon-si, South Korea) and Aenee Jang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower chip including a first lower bonding pad and a second lower bonding pad, and an upper chip disposed on the lower chip, the upper chip including a first upper bonding pad and a second upper bonding pad respectively hybrid-bonded together. The first lower and upper bonding pads have a first shape in which first and secon...