US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor device using multi-level signaling and coding method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,744,620, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor device using multi-level signaling and coding method thereof" was invented by Hyejeong So (Suwon-si, South Korea), Changkyu Seol (Suwon-si, South Korea) and Myoungbo Kwak (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor device transmitting a multi-level signal including: an encoder encoding user data into encoded data; and a transmission driver converting the encoded data into a multi-level signal. The encoder includes: a bit adder generating a codeword by adding at least one shaping parity ...