US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Semiconductor yield prediction method and apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,869, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor yield prediction method and apparatus" was invented by Taesoo Shin (Suwon-si, South Korea), Seulgi Ok (Suwon-si, South Korea), Kibum Lee (Suwon-si, South Korea) and Sungwook Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of predicting a semiconductor yield includes receiving wafer level data generated by measuring a plurality of wafers, generating a plurality of virtual chips corresponding to the plurality of wafers based on the wafer level data, mapping a test result of the plurality of wafers to the p...