US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor package including interposer" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,494, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including interposer" was invented by Soohyun Nam (Hwaseong-si, South Korea) and Haejung Yu (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes an interposer including a base layer and a plurality of interposer through-electrodes penetrating the base layer; at least one stacked structure attached to the interposer and including a first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, and a chip molding layer on a si...