US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor package including a pad comprising a connection portion connecting a first and second pad portions" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,496, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including a pad comprising a connection portion connecting a first and second pad portions" was invented by Jaesun Kim (Suwon-si, South Korea), Sanghyun Lee (Suwon-si, South Korea), Yeonho Jang (Suwon-si, South Korea) and Yunseok Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution structure in which redistribution layers and insulating layers are alternately stacked. A semiconductor chip is electrically connected to the redistribution layers, and bumps are electr...