US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,498, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Solji Song (Suwon-si, South Korea), Byeongchan Kim (Asan-si, South Korea), Jumyong Park (Cheonan-si, South Korea), Jinho An (Seoul, South Korea), Chungsun Lee (Asan-si, South Korea), Jeonggi Jin (Seoul, South Korea) and Juil Choi (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes an interposer having a first surface and a second surface opposite to the first surface and including a plurality of bonding pads,...