US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor package and method of manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,175, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Hajung Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes a first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, a front connection pad disposed on a lower surface of the plurality of second semiconductor chips, a rear connection pad attached on an upper surface of the first semiconductor chip and the second semiconducto...