US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,474, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Youngsang Cho (Seongnam-si, South Korea), Heeseok Lee (Suwon-si, South Korea) and Yunhyeok Im (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first interconnection structure, a first semiconductor chip on the first interconnection structure, an encapsulant covering the first semiconductor chip, a second interconnection structure on the first semiconductor chip and the encapsulant, including a plurality of interconnection layers, and having an opening having a...