US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Polishing apparatus for substrate and polishing method for substrate using the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,722,250, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Polishing apparatus for substrate and polishing method for substrate using the same" was invented by Donghoon Kwon (Hwaseong-si, South Korea), Hyojung Kim (Hwaseong-si, South Korea), Chungki Min (Hwaseong-si, South Korea) and Kihoon Jang (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing apparatus for a substrate, includes: a platen having a polishing pad attached to an upper surface thereof, and configured to rotate in a rotational direction, a temperature control unit configured to spray a temperature control fluid onto ...