ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,269, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Image sensor with stack structure and manufacturing method thereof" was invented by Byungjun Park (Suwon-si, South Korea), Jieun Kim (Suwon-si, South Korea) and Woojae Jang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor may include a first semiconductor chip including a pixel area and a peripheral area, the pixel area including a plurality of pixels, and a second semiconductor chip coupled to a lower surface of the first semiconductor chip, the second semiconductor chip including a plurality of logic elements, the ...