US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Hinge module and electronic device comprising same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,724,466, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Hinge module and electronic device comprising same" was invented by Jongkeun Kim (Suwon-si, South Korea), Myungchul Ryu (Suwon-si, South Korea), Giyun Lee (Suwon-si, South Korea), Minsung Lee (Suwon-si, South Korea), Iksu Jung (Suwon-si, South Korea), Yonghwa Han (Suwon-si, South Korea) and Seunghyun Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An hinge module configured to pivotably couple first and second housings, includes a hinge bracket, a first rotation member coupled with the first housing and disposed on the hinge bra...