US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Heat pump system and method for controlling the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,793, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Heat pump system and method for controlling the same" was invented by Sangyoon Han (Suwon-si, South Korea), Taeil Kim (Suwon-si, South Korea), Naeseong Lee (Suwon-si, South Korea), Minwoo Lee (Suwon-si, South Korea), Min Chang (Suwon-si, South Korea) and Seokhyun Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump system may include: a compressor configured to compress a refrigerant; a refrigerant-water heat exchanger configured to perform heat exchange between the compressed refrigerant and inlet water; an expansion valv...