US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Chip pick-up head, and chip detachment apparatus and method using the pick-up head" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,425, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Chip pick-up head, and chip detachment apparatus and method using the pick-up head" was invented by Minsung Kim (Suwon-si, South Korea) and Youngsoo Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip pick-up head includes a collet in contact with an upper surface of a chip of a diced wafer. The chip pick-up head detaches and picks up the chip from an adhesive film. The chip pick-up head further includes a head part coupled to the collet, a vibration transfer rod coupled to the head part and configured to transfer a vibration t...