US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor package comprising redistribution layer on wafer level chip scale package (WLCSP)" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,805, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package comprising redistribution layer on wafer level chip scale package (WLCSP)" was invented by Hyungsun Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a semiconductor chip having chip pads disposed on a first surface thereof; a redistribution wiring layer formed on the first surface, wherein the redistribution wiring layer includes an insulating layer, redistribution wirings, a protective layer, and an under bump metallurgy (UBM) pad of UBM pads, wherein the insulating layer is f...