US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,796, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Jeonggi Jin (Suwon-si, South Korea), Gyuho Kang (Suwon-si, South Korea), Unbyoung Kang (Suwon-si, South Korea), Taehee Kim (Suwon-si, South Korea) and Hyungjun Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor device including a substrate, bonding pads provided on a front surface of the substrate and bump structures provided on the bonding pads respectively, each of the bump structures having a metal pillar and...